SAM3X8E Atmel Corporation, SAM3X8E Datasheet - Page 1446

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SAM3X8E

Manufacturer Part Number
SAM3X8E
Description
Manufacturer
Atmel Corporation
Datasheets
Figure 46-4. 144-ball LFBGA Package Drawing
Table 46-11. Soldering Information (Substrate Level)
Table 46-12. Device and 144-ball BGA Package Maximum Weight
Table 46-13. 144-ball BGA Package Characteristics
Table 46-14. Package Reference
1446
Ball Land
Soldering Mask Opening
300
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
SAM3X/A
All dimensions are in mm
0.380 mm
0.280 mm
mg
3
none
e1
11057A–ATARM–17-Feb-12

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