AT32UC3L032-D3UR Atmel, AT32UC3L032-D3UR Datasheet - Page 814

MCU AVR32 32KB FLASH 48TLLGA

AT32UC3L032-D3UR

Manufacturer Part Number
AT32UC3L032-D3UR
Description
MCU AVR32 32KB FLASH 48TLLGA
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheet

Specifications of AT32UC3L032-D3UR

Core Processor
AVR
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, PWM, WDT
Number Of I /o
36
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 3.6 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TLLGA
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
SPI, TWI, USART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
36
Number Of Timers
7
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL
Development Tools By Supplier
AT32UC3L-EK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 9 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
33. Mechanical Characteristics
33.1
33.1.1
33.1.2
32099F–11/2010
Thermal Considerations
Thermal Data
Junction Temperature
Table 33-1
Table 33-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
Table
page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
783.
=
33-1.
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
AT32UC3L016/32/64
TLLGA48
TLLGA48
Package
TQFP48
TQFP48
QFN48
QFN48
Section 32.5 on
Table
30.06
63.2
21.8
28.3
TBD
Typ
2.5
33-1.
J
°C/W
°C/W
°C/W
in °C.
Unit
814

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