MM912H634CV1AE Freescale Semiconductor, MM912H634CV1AE Datasheet - Page 14

• Manufacturer Part Number: MM912H634CV1AE
• Description: 64KS12 LIN2xLS/HS Isense
• Manufacturer: Freescale Semiconductor
• Series: -r

Specifications of MM912H634CV1AE

• Applications: Automotive
• Core Processor: HCS12
• Program Memory Type: FLASH (64 kB)
• Controller Series: HCS12
• Ram Size: 6K x 8
• Interface: LIN
• Number Of I /o: -
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.3
This section describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following
data.
Freescale Semiconductor
5.0 V Supply Voltage (Supplying the MCU internal regulator for core and
flash)
2.5 V D2D - Supply Voltage
Digital I/O input voltage (PA0...PA7, PE0, PE1)
EXTAL, XTAL (PE0 and PE1 in alternative configuration)
TEST Input
Instantaneous Maximum Current
Instantaneous Maximum Current
Note:
Storage Temperature
Package (LQFP48), Thermal Resistance
Notes
Analog Die Nominal Operating Voltage
Analog Die Functional Operating Voltage - Device is fully functional. All
features are operating.
MCU I/O and Supply Voltage
MCU Digital Logic Supply Voltage
MCU Oscillator
MCU Bus frequency
Note:
Peak Package Reflow Temperature During Reflow
10.
12.
11.
13.
9.
Single pin limit for all digital I/O pins
Single pin limit for EXTAL, XTAL
MM912x634xxxAE
MM912x634xxxAP
MM912x634xxxAE
MM912x634xxxAP
All digital I/O pins are internally clamped to VSSRX and VDDRX.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
During power up and power down sequence always V
f
cause malfunction or permanent damage to the device.
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
BUSMAX
Operating Conditions
frequency ratings differ by device and is specified in
(12)
Ratings
Ratings
Ratings
(12)
Table 7. Maximum Electrical Ratings - MCU Die
Table 8. Maximum Thermal Ratings
MM912_634 Advance Information, Rev. 4.0
(10)
Table 9. Operating Conditions
,
(11)
DDD2D
Table 1
< V
DDRX
Symbol
Symbol
Symbol
V
V
V
V
V
V
T
V
T
DDD2D
R
SUPOP
DDD2D
f
f
V
DDRX
DDRX
V
PPRT
OSC
TEST
I
BUS
STG
SUP
I
DL
JA
ILV
D
IN
(9)
4.75 to 5.25
2.25 to 2.75
f
-0.3 to 2.16
-0.3 to 10.0
-0.3 to 6.0
-0.3 to 3.6
-0.3 to 6.0
-55 to 150
BUSMAX
-25 to 25
-25 to 25
5.5 to 18
5.5 to 27
4.0 to 16
4.0 to 16
max. 48
Note 11
Value
Value
Value
(13)
Operating Conditions
MHz
MHz
Unit
Unit
Unit
mA
mA
k
C
°C
V
V
V
V
V
V
V
V
V
14