MPC564MZP66 Freescale Semiconductor, MPC564MZP66 Datasheet - Page 1084

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MPC564MZP66

Manufacturer Part Number
MPC564MZP66
Description
IC MCU 512K FLASH 66MHZ 388-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564MZP66

Core Processor
PowerPC
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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IEEE 1149.1-Compliant Interface (JTAG)
9. Column Descriptions:
25.1.3
The MPC561/MPC563 JTAG implementation includes the public instructions (EXTEST,
SAMPLE/PRELOAD, and BYPASS), and also supports the CLAMP instruction. One additional public
instruction (HI-Z) provides the capability for disabling all device output drivers. The MPC561/MPC563
includes a 4-bit instruction register without parity consisting of a shift register with four parallel outputs.
Data is transferred from the shift register to the parallel outputs during the update-IR controller state. The
four bits are used to decode the five unique instructions listed in.
The parallel output of the instruction register is reset to all ones in the test-logic-reset controller state.
25-30
•r – resized cell instance
•Columns 1 through 8 are entries from the boundary-scan description from the BSDL file. The columns and formats for each
•Column 1: Defines the bit’s ordinal position in the boundary scan register. The shift register cell nearest TDO (i.e., first to be
•Column 2: References one of the three standard JTAG Cell Types (BC_4, BC_2, and BC_7) that are used for this JTAG cell
•Column 3: Lists the pin name (also called the PortID) for all pin-related cells. For JTAG control cells or data cells that have
•Column 4: Lists the BSDL pin function.
•Column 5: The “safe bit” column specifies the value that should be loaded into the capture (and update) flip-flop of a given
•Column 6: The “control cell” column identifies the cell number of the control cell that is associated with this data cell, and can
•Column 7: The “disable value” column gives the value that must be scanned into the control cell identified by the previous
•Column 8: The “disable result” column identifies a given signal value of the PortID if that signal can be disabled. The values
•Column 9: The “pin function” column indicates the normal system pin directionality. (– Input Only Pin, O – Output Only Pin,
•Column 10: The pad type column describes relevant characteristics about each pad type. See the Pad Type Keys in Note 5
of these entries are defined in the IEEE Std. 1149.1b-1994 Supplement to the IEEE Std. 1149.1-1990, IEEE Standard Test
Access Port and Boundary-Scan Architecture document. Descriptions of these columns are described below:
shifted in) is defined as bit 0; the last bit to be shifted in is 519.
in the MPC561/MPC563. See the IEEE Std. 1149.1-1990, IEEE Standard Test Access Port and Boundary-Scan Architecture
document for further description of these standard cell types.
been designated as “internal”, an asterisk, is shown in this column.
cell when board-level test generation software might otherwise choose a value randomly.
disable its output.
“control cell” (column 6) to disable the port named by the relevant portID.
shown specifies the condition of the driver of that signal when it is disabled.
I/O – Bidirectional I/O pin)
above.
Instruction Register
This preset state is equivalent to the BYPASS instruction.
1
B0 (LSB) is shifted first
B3
0
0
0
0
0
MPC561/MPC563 Reference Manual, Rev. 1.2
Table 25-3. Instruction Decoding
B2
X
0
0
1
1
Code
B1
0
0
1
0
0
NOTE
B0
X
0
1
0
1
1
CLAMP and BYPASS
SAMPLE/PRELOAD
Instruction
EXTEST
BYPASS
HI-Z
Freescale Semiconductor

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