SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 1062
SAM9G10
Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(1274 pages)
2.SAM9261.pdf
(43 pages)
3.SAM9G10.pdf
(750 pages)
4.SAM9G10.pdf
(39 pages)
Specifications of SAM9G10
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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45.3
Figure 45-1. Block Diagram
1062
1062
AHB
Bus
Block Diagram
SAM9G35
SAM9G35
CUE: Chroma Upsampling Engine
CSC: Color Space Conversion
2DSC: Two Dimension Scaler
DEAG: DMA Engine Address Generation
HEO: High End Overlay
32-bit
AHB
Master
Interface
32-bit
APB Interface
Configuration
Registers
DEAG
Unit
HCC
Layer
OVR1
Layer
Base
Layer
HEO
Layer
HCC: Hardware Cursor Channel
GAB: Global Alpha Blender
LTE: LCD Timing Engine
ROT: Hardware Rotation
SYSCTRL
Unit
CUE
CLUT
CLUT
ROT
CLUT
2DSC
CLUT
ROT
CSC
GAB
Unit
LTE
Unit
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
LCD_VSYNC
LCD_HSYNC
LCD_PWM
LCD_DAT[23:0]
LCD_PCLK
LCD_DEN
LCD_DISP
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