SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 315

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SAM9G10

Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G10

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
26. Bus Matrix (MATRIX)
26.1
26.2
11053B–ATARM–22-Sep-11
Description
Embedded Characteristics
The Bus Matrix implements a multi-layer AHB, based on the AHB-Lite protocol, that enables par-
allel access paths between multiple AHB masters and slaves in a system, thus increasing the
overall bandwidth. The Bus Matrix interconnects up to 16 AHB masters to up to 16 AHB slaves.
The normal latency to connect a master to a slave is one cycle except for the default master of
the accessed slave which is connected directly (zero cycle latency).
The Bus Matrix user interface is compliant with ARM Advanced Peripheral Bus and provides a
Chip Configuration User Interface with Registers that allow the Bus Matrix to support application
specific features.
• 12-layer Matrix, handling requests from 11 masters
• Programmable Arbitration strategy
• Burst Management
• One Address Decoder provided per Master
• Boot Mode Select
• Remap Command
– Fixed-priority Arbitration
– Round-Robin Arbitration, either with no default master, last accessed default master
– Breaking with Slot Cycle Limit Support
– Undefined Burst Length Support
– Three different slaves may be assigned to each decoded memory area: one for
– Non-volatile Boot Memory can be internal ROM or external memory on EBI_NCS0
– Selection is made by General purpose NVM bit sampled at reset
– Allows Remapping of an Internal SRAM in Place of the Boot Non-Volatile Memory
– Allows Handling of Dynamic Exception Vectors
or fixed default master
internal ROM boot, one for internal flash boot, one after remap
(ROM or External Flash)
SAM9G35
315

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