SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 426

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

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SAM9G35
SAM9G35
• Energy-saving Capabilities
• SDRAM Power-up Initialization by Software
• CAS Latency of 2, 3 Supported
• Reset Function Supported (DDR2-SDRAM)
• ODT (On-die Termination) Not Supported
• Auto Precharge Command Not Used
• SDR-SDRAM with 16-bit Datapath and Eight Columns Not Supported
• DDR2-SDRAM with Eight Internal Banks Supported
• Linear and Interleaved Decoding Supported
• SDR-SDRAM or Low-power DDR1-SDRAM with 2 Internal Banks Not Supported
• Clock Frequency Change in Precharge Power-down Mode Not Supported
• OCD (Off-chip Driver) Mode Not Supported
– Automatic Update of DS, TCR and PASR Parameters (Low-power SDRAM Devices)
– Self-refresh, Power-down, Active Power-down and Deep Power-down Modes
Supported
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11