SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 302

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

25.5.3.4
302
302
SAM9G35
SAM9G35
Power supplies
and
The product embeds a dual power supply for EBI. VDDNF for NAND Flash signals and VDDIOM
for others. This allows to use an 1.8V or 3.3V NAND Flash independently of SDRAM power
supply.
A switch, NFD0_ON_D16, enables the user to select NAND Flash path on D0-D15 or D16-D32
depending on memory power supplies. This switch is located in the register EBICSA in the Bus
Matrix user interface.
In the following example the NAND Flash and the external RAM (DDR2 or LP-DDR or 16-bit LP-
SDR) are in the same power supply range, (NFD0_ON_D16 = default).
– A[14] <=> DELAY6[27:24]
– A[15] <=> DELAY6[31:28]
– A[16] <=> DELAY7[3:0]
– A[17] <=> DELAY7[7:4]
– A[18] <=> DELAY7[11:8]
– A19 <=> DELAY7[15:12]
– A21 <=> PD[2] <=> DELAY7[23:20]
– A22 <=> PD[3] <=> DELAY7[27:24]
EBI
EBI
D[31:16]
D[15:0]
D[15:0]
A[22:21]
A[22:21]
D[31:16]
16-bit LP-SDR (1.8V)
D[15:0]
ALE
CLE
D[15:0]
ALE
CLE
D[15:0]
D[15:0]
32bit SDRAM (3.3V)
NAND Flash (1.8V)
NAND Flash (3.3V)
LP-DDR or
DDR2 or
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11