SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 928

no-image

SAM9G10

Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G10

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
When TSMODE = 2, each trigger event adds 4 half-words to the buffer (assuming TSAV=0), first
half-word being XPOS of ADC_XPOSR register followed by YPOS of ADC_YPOSR register and
finally Z1 followed by Z2, both located in ADC_PRESSR register.
When TAG is set (ADC_EMR), the CHNB field (4 most significant bit of the ADC_LCDR) register
is set to 0 when XPOS is transmitted and set to 1 when YPOS is transmitted, allowing an easier
post-processing of the buffer or better checking buffer integrity. In case 4-wire with pressure
mode is selected, Z1 value is transmitted to the buffer along with tag set to 2 and Z2 is tagged
with value 3.
XSCALE and YSCALE (calibration values) are not transmitted to the buffer because they are
supposed to be constant and moreover only measured at the very first start up of the controller
or upon user request.
There is no change in buffer structure whatever the value of PENDET bit configuration in
ADC_TSMR register but it is recommended to use the pen detection function for buffer post-pro-
cessing (refer to
“Pen Detection Status” on page
932).
SAM9G35
928
11053B–ATARM–22-Sep-11

Related parts for SAM9G10