SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 619

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

34.8.4
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Write Operation
In write operation, the HSMCI Mode Register (HSMCI_MR) is used to define the padding value
when writing non-multiple block size. If the bit PADV is 0, then 0x00 value is used when padding
data, otherwise 0xFF is used.
If set, the bit DMAEN in the HSMCI_DMA register enables DMA transfer.
The following flowchart
DMA facilities. Polling or interrupt method can be used to wait for the end of write according to
the contents of the Interrupt Mask Register (HSMCI_IMR).
(Figure
34-9) shows how to write a single block with or without use of
SAM9G35
SAM9G35
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