SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 176
SAM9G10
Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(1274 pages)
2.SAM9261.pdf
(43 pages)
3.SAM9G10.pdf
(750 pages)
4.SAM9G10.pdf
(39 pages)
Specifications of SAM9G10
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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21.4.3
176
SAM9G35
Switch from the 32,768 Hz Crystal to Internal 32 kHz RC Oscillator
The same procedure must be followed to switch from a 32,768 Hz crystal to the internal 32 kHz
RC oscillator.
• Switch the master clock to a source different from slow clock (PLL or Main Oscillator).
• Enable the internal 32 kHz RC oscillator for low power by setting the bit RCEN to 1
• Wait internal 32 kHz RC Startup Time for clock stabilization (software loop).
• Switch from 32768 Hz oscillator to internal RC by setting the bit OSCSEL to 0.
• Wait 5 slow clock cycles for internal resynchronization.
• Disable the 32768 Hz oscillator by setting the bit OSC32EN to 0.
• Switch the master clock back to the slow clock domain
11053B–ATARM–22-Sep-11
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