ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 269

MCU AVR 256KB FLASH A3B 64-QFN

ATXMEGA256A3B-MH

Manufacturer Part Number
ATXMEGA256A3B-MH
Description
MCU AVR 256KB FLASH A3B 64-QFN
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheets

Specifications of ATXMEGA256A3B-MH

Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
49
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATXMEGA256x
Core
AVR8
Data Bus Width
8 bit, 16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
49
Number Of Timers
7
Operating Supply Voltage
1.6 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATXMEGA256A3B-MU
ATXMEGA256A3B-MU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATXMEGA256A3B-MH
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
24.3.2
24.3.3
24.4
8077H–AVR–12/09
I/O Pin Configuration
Address Size
Chip Select as Address Lines
The base address associated with each chip select must be on a 4 Kbyte boundary, i.e to
address 0, 4096, 8192 etc.
The address size selects how many bits of the address that should be compared when generat-
ing a chip select. The address size can be anything from 256 bytes to 16M bytes. If the address
space is set to anything larger than 4K bytes, the base address must be on a boundary equal to
the address space. With 1M byte address space for a chip select, the base address must be on
a 0, 1M byte, 2M byte etc. boundary.
If the EBI is configured so that if the address spaces overlap, the internal memory space have
priority, followed by Chip Select 0 (CS0), CS1, CS2 and CS3.
If one or more Chip Select lines are unused, they can in some combinations be used as address
lines instead. This can enable larger external memory or external CS generation. Each column
in
able on unused chip select lines (Ann). Column four shows that all four CS lines are used as
address lines when only CS3 is enabled, and this is for SDRAM configuring.
Figure 24-1. Chip Select and address line combinations
When the EBI is enabled it will override the direction and/or value for the I/O pins where the EBI
lines are placed. The EBI will override the direction and value for the I/O pins where the EBI data
lines are placed. The EBI will only override value, but not direction for the I/O pins where the EBI
address and control lines are placed. These I/O pins must be configured to output when the EBI
is used. I/O pins for unused EBI address and control lines can be used as normal I/O pins or for
other alternate functions on the pins.
For control signals that are active-low, the pin output value should be set to one (high). For con-
trol signals that are active-high, pin output value should be set to zero (low). Address lines does
not requires specific pin output value configuration. The Chip Select lines should have pull-up
resistors to ensure that these are kept high during power-on and reset. If a Chip Select line is
active-high, a pull-down should be used instead of a pull-up.
For more details on I/O pin configuration refer to
Figure 24-1 on page 269
shows enabled chip select lines (CSn), and the address lines avail-
CS3
CS2
CS1
CS0
CS3
CS2
CS1
A16
Section 13. on page
CS3
CS2
A17
A16
A19
A18
A17
A16
129.
XMEGA A
269

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