ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 366

• Manufacturer Part Number: ATXMEGA256A3B-MH
• Description: MCU AVR 256KB FLASH A3B 64-QFN
• Manufacturer: Atmel
• Series: AVR® XMEGAr

Specifications of ATXMEGA256A3B-MH

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 49
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-MLF®, 64-QFN
• Processor Series: ATXMEGA256x
• Core: AVR8
• Data Bus Width: 8 bit, 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 49
• Number Of Timers: 7
• Operating Supply Voltage: 1.6 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Development Tools By Supplier: ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ATXMEGA256A3B-MU; ATXMEGA256A3B-MU

30.8
30.9
30.9.1
30.9.2
30.10 CRC Functionality
8077H–AVR–12/09
Protection of NVM
Preventing NVM Corruption
Write Corruption
Read Corruption
Alternative 2, fill the buffer before a Page Erase and Write:
To protect the Flash and EEPROM memories from write and/or read, Lock Bits can be set to
restrict access from external programmers and the Application Software. Refer to
Non-Volatile Memory Lock Bit Register” on page 29
and how to use them.
During periods when the V
result from a Flash memory read or write can be corrupt as supply voltage is too low for the CPU
and the Flash to operate properly.
To ensure that the voltage is correct during a complete write sequence to the Flash memory, the
BOD is automatically enabled by hardware when the write sequence starts. If a BOD reset
occurs, the programming sequence will be aborted immediately. If this happens, the NVM pro-
gramming should be restarted when the power is sufficient again in case the write sequence
failed or only partly succeeded.
The NVM can be read incorrectly if the supply voltage is too low so the CPU execute instructions
incorrectly. To ensure that this does not happen the BOD can be enabled.
It is possible to run an automatic Cyclic Redundancy Check (CRC) on the Flash Program Mem-
ory. This can be issued from external programming or software to do a CRC on the Application
Section, Boot Loader Section or a selected address range of the Flash.
Once the CRC is started, the CPU will be halted until the CRC is done and the checksum is
available in the NVM Data Register. The CRC takes one CPU Clock cycle per word that is
included in the CRC address range.
The polynomial that is used for CRC is fixed, and this is: x
• Perform a EEPROM Page Erase.
• Perform a EEPROM Page Write.
• Fill the EEPROM page buffer with the selected number of bytes.
• Perform an EEPROM Page Erase and Write.
CC
voltage is below the minimum operating voltage for the device, the
for details on the available Lock Bit settings
24
+ 4x
3
+ 3x +1.
XMEGA A
”LOCKBITS -
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