ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 275

MCU AVR 256KB FLASH A3B 64-QFN

ATXMEGA256A3B-MH

Manufacturer Part Number
ATXMEGA256A3B-MH
Description
MCU AVR 256KB FLASH A3B 64-QFN
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheets

Specifications of ATXMEGA256A3B-MH

Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
49
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATXMEGA256x
Core
AVR8
Data Bus Width
8 bit, 16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
49
Number Of Timers
7
Operating Supply Voltage
1.6 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATXMEGA256A3B-MU
ATXMEGA256A3B-MU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATXMEGA256A3B-MH
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
24.8.4
24.8.5
24.8.6
24.9
8077H–AVR–12/09
Combined SRAM & SDRAM Configuration
Timing
Initialization
Refresh
Figure 24-9. 4-Port SDRAM configuration
The Clock Enable (CKE) signal is required for SDRAM when the EBI is clocked at 2x the CPU
clock speed.
Configuring Chip Select 3 to SDRAM will enable the initialization of the SDRAM. The “Load
Mode Register” command is automatically issued at the end of the initialization. For the correct
information to be loaded to the SDRAM, one must do one of the following:
1.
2.
initialized.
The SDRAM initialization is non-interruptible by other EBI accesses.
The EBI will automatically handle the refresh of the SDRAM as long as the refresh period is con-
figured. Refresh will be done as soon as available after the refresh counter reaches the period.
The EBI can collect up to 4 refresh commands in case the interface is busy on another chip
select or in the middle of a read/write at a time a refresh should have been performed.
Combined SRAM and SDRAM configuration enables the EBI to have both SDRAM and SRAM
connected at the same time. This only available for devices with 4 port EBI interface.
10 on page 276
Configure SDRAM control registers before enabling Chip Select 3 to SDRAM.
Issue a “Load Mode Register” command and perform a dummy-access after SDRAM is
EBI
shows the configuration with all interface signals.
CAS/RE
BA[1:0]
CS[3:0]
A[11:8]
A[7:0]]
D[7:0]
DQM
CKE
RAS
CLK
WE
CLK
CKE
BA[1:0]
DQM
WE
RAS
CAS
D[7:0]
A[7:0]
A[11:8]
CS
SDRAM
XMEGA A
Figure 24-
275

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