ATXMEGA256A3B-MH Atmel, ATXMEGA256A3B-MH Datasheet - Page 374

MCU AVR 256KB FLASH A3B 64-QFN

ATXMEGA256A3B-MH

Manufacturer Part Number
ATXMEGA256A3B-MH
Description
MCU AVR 256KB FLASH A3B 64-QFN
Manufacturer
Atmel
Series
AVR® XMEGAr
Datasheets

Specifications of ATXMEGA256A3B-MH

Core Processor
AVR
Core Size
8/16-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
49
Program Memory Size
256KB (128K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-MLF®, 64-QFN
Processor Series
ATXMEGA256x
Core
AVR8
Data Bus Width
8 bit, 16 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
49
Number Of Timers
7
Operating Supply Voltage
1.6 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATSTK600 - DEV KIT FOR AVR/AVR32770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ATXMEGA256A3B-MU
ATXMEGA256A3B-MU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATXMEGA256A3B-MH
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
30.11.2.14
30.11.3
Table 30-3.
30.11.3.1
30.11.3.2
8077H–AVR–12/09
CMD[6:0]
0x00
Fuses and Lock Bits
0x07
0x08
NVM Fuse and Lock Bit Commands
Group Configuration
NO_OPERATION
READ_FUSES
WRITE_LOCK_BITS
Read User Signature Row / Calibration Row
Write Lock Bits Write
Read Fuses
Fuse and Lock Bit Commands
The Read User Signature Row and Red Calibration Row commands are used to read one byte
from the User Signature Row or Calibration Row.
The destination register will be loaded during the execution of the LPM instruction.
The NVM Flash commands that can be used for accessing the Fuses and Lock Bits are listed in
Table
For self-programming of the Fuses and Lock Bits, the Trigger for Action Triggered Commands is
to set the CMDEX bit in the NVM CTRLA register (CMDEX). The Read Triggered Commands
are triggered by executing the (E)LPM instruction (LPM). The Write Triggered Commands is trig-
gered by a executing the SPM instruction (SPM).
The Change Protected column indicate if the trigger is protected by the Configuration Change
Protection (CCP) during self-programming. The two last columns shows the address pointer
used for addressing, and the source/destination data register.
Section 30.11.3.1 on page 374
algorithm for each NVM operation.
The Write Lock Bits command is used to program the Boot Lock Bits to a more secure settings
from software.
1.
2.
3.
during self-programming.
The BUSY flag in the NVM STATUS register will be set until the command is finished. The CPU
is halted during the complete execution of the command.
This command can be executed from both the Boot Loader Section and the Application Section.
The EEPROM and Flash Page Buffer is automatically erased when the Lock Bits are written.
The Read Fuses command is used to read the Fuses from software.
1. Load the Z-pointer with the byte address to read.
2. Load the NVM CMD register with the Read User Signature Row / Calibration Row
3. Execute the LPM instruction.
command
Load the NVM DATA0 register with the new Lock bit value.
Load the NVM CMD register with the Write Lock Bit command.
Set the CMDEX bit in the NVM CTRLA register. This requires the timed CCP sequence
30-3.
Description
No Operation
Read Fuses
Write Lock Bits
through
Trigger
CMDEX
CMDEX
-
Section 30.11.3.2 on page 374
CPU
Halted
N
N
-
Change
Protected
N
Y
-
Address
pointer
ADDR
ADDR
-
explain in details the
XMEGA A
Data
register
DATA
-
-
NVM
Busy
Y
Y
-
374

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