QG82945GSE S LB2R Intel, QG82945GSE S LB2R Datasheet - Page 33

• Manufacturer Part Number: QG82945GSE S LB2R
• Description: GRAPHICS AND MEM CNTRL HUB; No. of Pins: 998; Package / Case: FCBGA; Interface Type: PCI, SATA, USB
• Manufacturer: Intel

Introduction
Datasheet
NCTF
NTSC
PAL
PEG
PWM
Rank
SCI
SDVO
SDVO Device
x1
x8
x16
xN
VLD
VTT
Term
Non-Critical to Function
As a function of Intel's continuous improvement goals, we have identified
package level modifications that add to the overall solder joint strength and
reliability of our component. Through our research and development, we have
concluded that adding non-critical to function (NCTF) solder balls to our
packages can improve the overall package-to-board solder joint strength and
reliability.
Ball locations/signal ID's followed with the suffix of “NCTF” have been
designed into the package footprint to enhance the package to board solder
joint strength/reliability of this product by absorbing some of the stress
introduced by the Characteristic Thermal Expansion (CTE) mismatch of the
Die to package interface.
It is expected that in some cases, where board stresses are excessive, these
balls may crack partially or completely, however, cracks in the NCTF balls will
have no impact to our product performance or reliability. Intel has added
these balls primarily to serve as stress absorbers.
National Television Standards Committee
Phase Alternate Line
External Graphics using PCI Express* Architecture
A high-speed serial interface whose configuration is software compatible with
the existing PCI specifications. The specific PCI Express implementation
intended for connecting the (G)MCH to an external graphics controller is an
x16 link
Pulse Width Modulation
A unit of DRAM corresponding 4 to 8 devices in parallel, ignoring ECC. These
devices are usually, but not always, mounted on a single side of a SO-DIMM.
System Control Interrupt. Used in ACPI protocol
Serial Digital Video Out (SDVO)
Digital display channel that serially transmits digital display data to an
external SDVO device. The SDVO device accepts this serialized format and
then translates the data into the appropriate display format (i.e., TMDS, LVDS,
TV-Out). This interface is not electrically compatible with the previous digital
display channel - DVO. For the Mobile Intel 945GM/GME and Intel 945GT
Express Chipsets, it will be multiplexed on a portion of the x16 graphics PCI
Express interface.
Third party codec that utilizes SDVO as an input. May have a variety of output
formats, including DVI, LVDS, TV-out, etc.
Refers to a Link or Port with one Physical Lane
Refers to a Link or Port with eight Physical Lanes
Refers to a Link or Port with sixteen Physical Lanes
Refers to a Link with “N” Physical Lanes
Variable Length Decoding
Front Side Bus Power Supply (VCCP)
(Sheet 2 of 2)
Description
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