QG82945GSE S LB2R Intel, QG82945GSE S LB2R Datasheet - Page 472

• Manufacturer Part Number: QG82945GSE S LB2R
• Description: GRAPHICS AND MEM CNTRL HUB; No. of Pins: 998; Package / Case: FCBGA; Interface Type: PCI, SATA, USB
• Manufacturer: Intel

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Package Mechanical Information
Mobile Intel 945GM/GME/PM, 943/940GML and Intel
945GT Express Chipset Package Information
The Mobile Intel 945GM/GME/PM, 943/940GML and Intel 945GT Express Chipsets come
in an FCBGA package, which is similar to the Mobile Processor package. The package
consists of a silicon die mounted face down on an organic substrate populated with
solder balls on the bottom side. Capacitors may be placed in the area surrounding the
die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors
with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive.
The use of an insulating material between the capacitors and any thermal solution
should be considered to prevent capacitor shorting. An exclusion, or keep out area,
surrounds the die and capacitors, and identifies the contact area for the package. Care
should be taken to avoid contact with the package inside this area.
The Mobile Intel 945GM/GME/PM, 943/940GML and Intel 945GT Express Chipset
package is a 1466 ball FCBGA. Unless otherwise specified, interpret the dimensions and
tolerances in accordance with ASME Y14.5-1994. The dimensions are in millimeters.
Tolerances:
• Package parameters: 37.5 mm x 37.5 mm
• Land metal diameter: 524 microns
• Solder resist opening: 470 microns
• .X - ± 0.1
• .XX - ± 0.05
• Angles - ± 1.0 degrees
Ballout and Package Information
Datasheet