QG82945GSE S LB2R Intel, QG82945GSE S LB2R Datasheet - Page 54

• Manufacturer Part Number: QG82945GSE S LB2R
• Description: GRAPHICS AND MEM CNTRL HUB; No. of Pins: 998; Package / Case: FCBGA; Interface Type: PCI, SATA, USB
• Manufacturer: Intel

54
CRT DAC
Note: These
signals are Not on
the Ultra Mobile
Intel 945GU
Express Chipset.
LVDS
TVDAC
I/O
Core
Ground
NCTF
Interface
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Non-Critical To Function power signals:
“NCTF” (Non-Critical To Function) have been designed into the package
footprint to enhance the Solder Joint Reliability of our products by
absorbing some of the stress introduced by the Characteristic Thermal
Expansion (CTE) mismatch of the Die to package interface. It is expected
that in some cases, these balls may crack partially or completely,
however, this will have no impact to our product performance or reliability.
Intel has added these balls primarily to serve as sacrificial stress
absorbers.
V
V
V
CCA_CRTDAC
SSA_CRTDAC
CC_SYNC
CCD_LVDS
CCTX_LVDS
CCA_LVDS
SSA_LVDS
CCA_TVBG
SSA_TVBG
CCD_TVDAC
CCDQ_TVDAC
CCA_TVDACA
CCA_TVDACB
CCA_TVDACC
CC_AUX
CC
SS
CC_NCTF
CCSM_NCTF
SS_NCT
Ball Name
F
(Sheet 2 of 2)
Analog power supply for the DAC (2.5 V)
Analog ground for the DAC
Power supply for HSYNC/ VSYNC (2.5 V)
Digital power supply (1.5 V)
Data/Clk Tx power supply (2.5 V)
LVDS analog power supply (2.5 V)
LVDS analog VSS
TV DAC Band Gap Power (3.3 V)
TV DAC Band Gap VSS
Dedicated Power Supply for TVDAC (1.5 V)
Power Supply for Digital Quiet TVDAC (1.5 V)
Power Supply for TV Out Channel A (3.3 V)
Power Supply for TV Out Channel B (3.3 V)
Power Supply for TV Out Channel C (3.3 V)
Power Supply for DDR DLLs, DDR IO, FSB HSIO, and
FSB IO (1.5 V)
Core V
Ground
NTCF Core V
NTCF V
NTCF Ground
CC
CC_AUX
(1.05 V/ 1.5 V)
CC
power supply 1.5 V
(1.05 V/ 1.5 V)
Description
Signal Description
Datasheet