D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 207

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 6.2
(n = 0 to 7)
Read Strobe Timing: RDNCR can be used to select either of two negation timings (at the end of
the read cycle or one half-state before the end of the read cycle) for the read strobe (RD) used in
the basic bus interface space.
Chip Select (CS
time and hold time between address and CS signals and strobe signals such as RD, HWR, and
LWR. CSACR can be used to insert states in which only the CS, AS, and address signals are
asserted before and after a basic bus space access cycle.
ABWCR
ABWn
0
1
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
CS
CS
CS) Assertion Period Extension States: Some external I/O devices require a setup
Wn2
0
1
0
1
WTCRA, WTCRB
Wn1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Wn0
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Rev. 3.00 Mar 17, 2006 page 155 of 926
Section 6 Bus Controller (BSC)
Access
States
2
3
2
3
REJ09B0283-0300
Program Wait
States
0
0
1
2
3
4
5
6
7
0
0
1
2
3
4
5
6
7

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