D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 764

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 15 Serial Communication Interface (SCI, IrDA)
Rev. 3.00 Mar 17, 2006 page 712 of 926
REJ09B0283-0300
Serial clock
Serial data
TDRE
TEND
TXI interrupt
request generated
Figure 15.16 Sample SCI Transmission Operation in Clocked Synchronous Mode
Data written to TDR
and TDRE flag
cleared to 0 in TXI
interrupt handling routine
Bit 0
Transfer direction
Bit 1
1 frame
TXI interrupt
request generated
Bit 7
Bit 0
Bit 1
Bit 6
TEI interrupt
request generated
Bit 7

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