D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 930

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
Note:
Rev. 3.00 Mar 17, 2006 page 878 of 926
REJ09B0283-0300
Item
Self-refresh precharge time 1
Self-refresh precharge time 2
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Address delay time 2 *
CS delay time 4 *
DQM delay time *
CKE delay time *
Read data setup time 3 *
Read data hold time 3 *
Write data delay time 2 *
Write data hold time 4 *
* Not supported in the H8S/2678 Group.
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
RPS1
RPS2
WTS
WTH
BREQS
BACD
BZD
BRQOD
AD2
CSD4
DQMD
CKED
RDS3
RDH3
WDD2
WDH3
Min
2.5
3.0
25
5
30
15
0
2
t
t
cyc
cyc
– 20
– 20
Max
15
40
25
16.5
16.5
16.5
16.5
31.5
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figures 24.22,
24.23
Figure 24.15
Figure 24.24
Figure 24.25
Figure 24.26
Figure 24.26
Figure 24.26
Figure 24.27
Figure 24.26
Figure 24.26
Figure 24.26
Figure 24.26

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