D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 940

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

Section 24 Electrical Characteristics
Rev. 3.00 Mar 17, 2006 page 888 of 926
REJ09B0283-0300
Read
Write
EDACK0 to EDACK3
Notes:
DACK0, DACK1
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
DACK and EDACK timing: when DDS = 1 and EDDS = 1
RAS timing: when RAST = 0
Figure 24.16 DRAM Access Timing: Two-State Burst Access
Tp
Tr
Tc1
t
t
DACD1
EDACD1
Tc2
t
t
RCH
RCS1
t
t
DACD2
EDACD2
Tc1
t
CPW1
t
AC3
Tc2