D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 870

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Clock Pulse Generator
consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the oscillator pin.
21.5.3
When using the crystal resonator, place the crystal resonator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillation circuit to prevent induction from interfering with correct oscillation. See figure 21.6.
Figure 21.7 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Rev. 3.00 Mar 17, 2006 page 818 of 926
REJ09B0283-0300
Notes on Board Design
Note: * CB and CPB are laminated ceramic capacitors.
Figure 21.7 Recommended External Circuitry for PLL Circuit
Figure 21.6 Note on Board Design for Oscillation Circuit
Avoid
C
C
L2
L1
PLLV
PLLV
V
V
CC
CC
SS
SS
Signal A Signal B
Rp: 200
CPB: 0.1 µF *
CB: 0.1 µF *
XTAL
EXTAL
This LSI

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