D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 236

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller (BSC)
6.6.10
When DRAM with a 16-bit configuration is connected, the 2-CAS access method is used for the
control signals needed for byte access. Figure 6.28 shows the control timing for 2-CAS access, and
figure 6.29 shows an example of 2-CAS DRAM connection.
Rev. 3.00 Mar 17, 2006 page 184 of 926
REJ09B0283-0300
Address bus
RASn (CSn)
UCAS
LCAS
WE (HWR)
OE (RD)
Upper data bus
Lower data bus
Note: n = 2 to 5
Byte Access Control
(Upper Byte Write Access: RAST = 0, CAST = 0)
Figure 6.28 2-CAS Control Timing
T
p
Row address
High
High
T
r
T
c1
Column address
Write data
High-Z
T
c2

Related parts for D12674RVFQ33D