D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 939

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Read
Write
Notes:
EDACK0 to EDACK3
DACK0, DACK1
A23 to A0
RAS5 to RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE, RD
HWR
D15 to D0
AS
WAIT
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 0
Tcw : Wait cycle inserted by programmable wait function
Tcwp: Wait cycle inserted by pin wait function
Figure 24.15 DRAM Access Timing: Two-State Access, One Wait
Tp
Tr
Tc1
Rev. 3.00 Mar 17, 2006 page 887 of 926
t
WTS
Tcw
Section 24 Electrical Characteristics
t
WTH
t
WTS
Tcwp
t
WTH
REJ09B0283-0300
Tc2

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