D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 385
D12674RVFQ33D
Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet
1.D12674RVFQ33V.pdf
(981 pages)
Specifications of D12674RVFQ33D
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D
HD6412674RVFQ33D
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 385 of 981
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7.7.5
DREQ pin falling edge detection is performed in synchronization with DMAC internal operations.
The operation is as follows:
[1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and
[2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and
After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer is
enabled is performed on detection of a low level.
switches to [2].
switches to [1].
Internal write signal
Internal read signal
Activation by Falling Edge on DREQ
External address
Figure 7.41 Example in Which Low Level Is Not Output at TEND
Internal address
HWR, LWR
TEND
DREQ
DREQ Pin
DREQ
External write by CPU, etc.
Not output
DMA
read
Rev. 3.00 Mar 17, 2006 page 333 of 926
Section 7 DMA Controller (DMAC)
DMA
write
TEND
TEND
TEND Pin
REJ09B0283-0300
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