D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 950

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
DMAC and EXDMAC Timing
Table 24.9 DMAC and EXDMAC Timing
Conditions: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
EDREQ setup time
EDREQ hold time
ETEND delay time
EDACK delay time 1
EDACK delay time 2
EDRAK delay time
Rev. 3.00 Mar 17, 2006 page 898 of 926
REJ09B0283-0300
T
a
CC
= 8 MHz to 33 MHz, T
= –40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
EDRQS
EDRQH
ETED
EDACD1
EDACD2
EDRKD
a
CC
= –20°C to +75°C (regular specifications),
= 3.0 V to 3.6 V, V
Min
25
10
25
10
Max
18
18
18
18
18
18
18
ref
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
Test Conditions
Figure 24.32
Figure 24.31
Figures 24.29, 24.30
Figure 24.32
Figure 24.31
Figures 24.29, 24.30
Figure 24.33
CC
, V
SS
= AV
SS
= 0 V,

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