D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 91

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

Table 2.3
Note:
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM
STM
* Size refers to the operand size.
B: Byte
W: Word
L: Longword
Data Transfer Instructions
L
Size *
B/W/L
B
B
W/L
W/L
L
Function
(EAs)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+
Pops two or more general registers from the stack.
Pushes two or more general registers onto the stack.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+
Rn
Rn (register list)
@–SP
Rd, Rs
Rn
Rn (register list)
@–SP
(EAd)
Rev. 3.00 Mar 17, 2006 page 39 of 926
REJ09B0283-0300
Section 2 CPU