D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 248

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

Section 6 Bus Controller (BSC)
or EXDMAC single address mode at the same time, these bits select whether or not burst access is
to be performed.
When DDS = 1 or EDDS = 1: Burst access is performed by determining the address only,
irrespective of the bus master. With the DRAM interface, the DACK or EDACK output goes low
from the T
Figure 6.41 shows the DACK or EDACK output timing for the DRAM interface when DDS = 1 or
EDDS = 1.
Rev. 3.00 Mar 17, 2006 page 196 of 926
REJ09B0283-0300
Figure 6.41 Example of DACK
Read
Write
Note: n = 2 to 5
c1
DACK or EDACK
state.
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK/EDACK
DACK
DACK
(RAST = 0, CAST = 0)
T
EDACK Output Timing when DDS = 1 or EDDS = 1
EDACK
EDACK
p
Row address
High
High
T
r
T
c1
Column address
T
c2