D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 971

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
C.
For package dimensions, dimensions described in Renesas Semiconductor Packages have priority.
P-LQFP144-20x20-0.50
JEITA Package Code
Package Dimensions
109
144
e
108
1
Z
D
PLQP0144KC-A
RENESAS Code
Index mark
*1
H
D
Figure C.1 Package Dimensions (FP-144H)
D
y
*3
b
FP-144H/FP-144HV
p
Previous Code
73
36
72
37
x
F
M
MASS[Typ.]
1.4g
Rev. 3.00 Mar 17, 2006 page 919 of 926
Terminal cross section
Detail F
b
b
p
1
L
1
L
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
REJ09B0283-0300
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
21.7
21.7 22.0 22.3
0.04
0.17
0.12
Min
0.4
Appendix
Nom
1.45
22.0
0.12
0.22
0.20
0.17
0.15
1.25
1.25
0.5
0.5
1.0
20
20
Max
22.3
1.70
0.20
0.27
0.22
0.08
0.10
0.6

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