D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 971

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

C.
For package dimensions, dimensions described in Renesas Semiconductor Packages have priority.
P-LQFP144-20x20-0.50
JEITA Package Code
Package Dimensions
109
144
e
108
1
Z
D
PLQP0144KC-A
RENESAS Code
Index mark
*1
H
D
Figure C.1 Package Dimensions (FP-144H)
D
y
*3
b
FP-144H/FP-144HV
p
Previous Code
73
36
72
37
x
F
M
MASS[Typ.]
1.4g
Rev. 3.00 Mar 17, 2006 page 919 of 926
Terminal cross section
Detail F
b
b
p
1
L
1
L
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
REJ09B0283-0300
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
21.7
21.7 22.0 22.3
0.04
0.17
0.12
Min
0.4
0°
Appendix
Nom
1.45
22.0
0.12
0.22
0.20
0.17
0.15
1.25
1.25
0.5
0.5
1.0
20
20
Max
22.3
1.70
0.20
0.27
0.22
0.08
0.10
0.6
8°