D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 942

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
Rev. 3.00 Mar 17, 2006 page 890 of 926
REJ09B0283-0300
Read
Write
Notes:
EDACK0, EDACK1
DACK0, DACK1
A23 to A0
RAS5 to RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE
HWR
D15 to D0
WAIT
Tcw :
Tcwp:
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 0
Figure 24.18 DRAM Access Timing: Three-State Access, One Wait
Wait cycle inserted by programmable wait function
Wait cycle inserted by pin wait function
Tp
Tr
Tc1
t
WTS
Tcw
t
WTH
t
WTS
Tcwp
t
WTH
Tc2
Tc3

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