HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 111

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
4.6
When accessing word data or longword data, the H8/3029 regards the lowest address bit as 0. The
stack should always be accessed by word access or longword access, and the value of the stack
pointer (SP, ER7) should always be kept even.
Use the following instructions to save registers:
Use the following instructions to restore registers:
Setting SP to an odd value may lead to a malfunction. Figure 4.6 shows an example of what
happens when the SP value is odd.
Rev. 2.0, 06/04, page 82 of 980
PUSH.W Rn
PUSH.L ERn
POP.W Rn
POP.L ERn
Notes on Stack Usage
(or MOV.W Rn, @–SP)
(or MOV.L ERn, @–SP)
(or MOV.W @SP+, Rn)
(or MOV.L @SP+, ERn)

Related parts for HD64F3029XBL25V