HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 984
HD64F3029XBL25V
Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.HD64F3029X25.pdf
(1012 pages)
Specifications of HD64F3029XBL25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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PB
5
WPBD:
WPB:
RPB:
SSOE:
Hardware
standby
Write to PBDDR
Write to port B
Read port B
Software standby output port enable
Figure C.11 (f) Port B Block Diagram (Pin PB
Note: In mode 7, CAS output enable is fixed at 0.
Q
Q
WPBD
PB
RPB
Reset
Reset
PB
5
R
C
R
C
DDR
5
DR
D
D
External bus release
Software standby
SSOE
Rev. 2.0, 06/04, page 955 of 980
WPB
5
)
SCI
TPC
SCI
Bus controller
Clock input
enable
TPC output enable
Next data
Output trigger
CAS output enable
Clock output
enable
Clock output
Clock input
CAS output
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