HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 663

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.7
To provide real-time emulation in RAM of data that is to be written to the flash memory, a part of
the RAM can be overlaid on an area of flash memory (user MAT) that has been specified by the
RAM control register (RAMCR). After the RAMCR setting is made, the RAM is accessible in
both the user MAT area and as the RAM area that has been overlaid on the user MAT area. Such
emulation is possible in both user mode and user-program mode.
Figures 18.17 and 18.18 show an example of the emulation of realtime programming of the user
MAT area.
Rev. 2.0, 06/04, page 634 of 980
Flash Memory Emulation in RAM
Figure 18.17 Emulation of Flash Memory in RAM
No
Execute application program
Start of emulation program
Write the data for tuning to
End of emulation program
Program the user MAT
with the emulated block
Cancel RAMCR setting
the overlaid RAM area
Tuning OK?
Set RAMCR
Yes