HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 736

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

20.4.4
Figure 20.1 shows an example in which software standby mode is entered at the fall of NMI and
exited at the rise of NMI.
With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an
NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit
is set to 1; then the SLEEP instruction is executed to enter software standby mode.
Software standby mode is exited at the next rising edge of the NMI signal.
20.4.5
The I/O ports retain their existing states in software standby mode. If a port is in the high output
state, its output current is not reduced.
Clock
oscillator
NMI
NMIEG
SSBY
Sample Application of Software Standby Mode
Note
Figure 20.1 NMI Timing for Software Standby Mode (Example)
NMI interrupt
handler
NMIEG = 1
SSBY = 1
SLEEP
instruction
Software standby
mode (power-
down state)
Oscillator
settling time
(t
osc2
)
Rev. 2.0, 06/04, page 707 of 980
NMI exception
handling