HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 767

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 21.17 Timing of On-Chip Supporting Modules
Conditions: T
Module Item
Ports
and
TPC
16-bit
timer
8-bit
timer
Rev. 2.0, 06/04, page 738 of 980
Output data
delay time
Input data setup
time
Input data hold
time
Timer output
delay time
Timer input
setup time
Timer clock
input setup time
Timer
clock
pulse
width
Timer output
delay time
Timer input
setup time
Timer clock
input setup time
Timer
clock
pulse
width
V
fmax = 25 MHz
a
CC
= –40°C to +85°C (Wide-range specifications),
= 3.0 V to 3.6 V, AV
Single
edge
Both
edges
Single
edge
Both
edges
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
PWD
PRS
PRH
TOCD
TICS
TCKS
TCKWH
TCKWL
TOCD
TICS
TCKS
TCKWH
TCKWL
CC
= 3.0 V to 3.6 V, V
Min
50
50
50
50
1.5
2.5
50
50
1.5
2.5
Max
50
50
50
REF
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
ns
t
t
ns
ns
ns
t
t
cyc
cyc
cyc
cyc
CC
, V
SS
Test
Conditions
Figure 21.22
Figure 21.23
Figure 21.24
Figure 21.23
Figure 21.24
= AV
SS
= 0 V,

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