HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 179

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
16-Bit, Three-State-Access Areas
Figures 6.11 to 6.13 show the timing of bus control signals for a 16-bit, three-state-access area. In
these areas, the upper data bus (D
bus (D
Rev. 2.0, 06/04, page 150 of 980
7
Figure 6.11 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1)
to D
Read access
Write access
Note: n = 7 to 0
0
) in accesses to odd addresses. Wait states can be inserted.
Address bus
D
D
D
D
HWR
15
15
LWR
CSn
7
7
RD
AS
to D
to D
to D
to D
0
0
8
8
(Byte Access to Even Address)
15
to D
8
) is used in accesses to even addresses and the lower data
High
T
1
Even external address in area n
Undetermined data
Bus cycle
T
2
Valid
T
Invalid
Valid
3

Related parts for HD64F3029XBL25V