HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 823

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table A.3
Execution State
(Cycle)
Instruction fetch
Branch address read S
Stack operation
Byte data access
Word data access
Internal operation
Legend
m:
Rev. 2.0, 06/04, page 794 of 980
Number of wait states inserted into external device access
Number of States per Cycle
S
S
S
S
S
I
J
K
L
M
N
On-Chip
Memory
2
1
On-Chip Sup-
porting Module
8-Bit
Bus
6
3
6
16-Bit
Bus
3
Access Conditions
2-State
Access
4
2
4
8-Bit Bus
3-State
Access
6 + 2m
3 + m
6 + 2m
External Device
16-Bit Bus
2-State
Access
2
3-State
Access
3 + m