HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 547

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

14.1.2
Figure 14.1 shows a block diagram of the smart card interface.
14.1.3
Table 14.1 shows the smart card interface pins.
Table 14.1 Smart Card Interface Pins
Pin Name
Serial clock pin
Receive data pin
Transmit data pin
Rev. 2.0, 06/04, page 518 of 980
RxD
TxD
SCK
Legend
SCMR: Smart card mode register
RSR:
RDR:
TSR:
TDR:
SMR:
SCR:
SSR:
BRR:
Receive shift register
Receive data register
Transmit shift register
Transmit data register
Serial mode register
Serial control register
Serial status register
Bit rate register
Block Diagram
Pin Configuration
RDR
RSR
Figure 14.1 Block Diagram of Smart Card Interface
Abbreviation
SCK
RxD
TxD
Parity generation
Parity check
TDR
TSR
Module data bus
Transmission/
reception
I/O
I/O
Input
Output
control
SCMR
SMR
SSR
SCR
External clock
Clock
Function
Clock input/output
Receive data input
Transmit data output
Baud rate
generator
BRR
TXI
RXI
ERI
/4
/16
/64
Internal
data bus