HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 812

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

4. Shift instructions
Mnemonic
SHAL.B Rd
SHAL.W Rd
SHAL.L ERd
SHAR.B Rd
SHAR.W Rd
SHAR.L ERd
SHLL.B Rd
SHLL.W Rd
SHLL.L ERd
SHLR.B Rd
SHLR.W Rd
SHLR.L ERd
ROTXL.B Rd
ROTXL.W Rd
ROTXL.L ERd
ROTXR.B Rd
ROTXR.W Rd
ROTXR.L ERd
ROTL.B Rd
ROTL.W Rd
ROTL.L ERd
ROTR.B Rd
ROTR.W Rd
ROTR.L ERd
W
W
W
W
W
W
W
W
B
L
B
L
B
L
B
L
B
L
B
L
B
L
B
L
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Addressing Mode and
Operation
0
C
C
MSB
C
MSB
C
MSB
MSB
MSB
MSB
MSB
MSB
LSB
LSB
LSB
LSB
LSB
LSB
LSB
LSB
Rev. 2.0, 06/04, page 783 of 980
C
C
C
C
0
0
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
— —
I
Condition Code
H N Z
V C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
States*
No. of
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1