HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 59

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

2.6
2.6.1
The H8/300H CPU has 62 types of instructions, which are classified in table 2.1.
Table 2.1
Function
Data transfer
Arithmetic operations ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA, DAS,
Logic operations
Shift operations
Bit manipulation
Branch
System control
Block data transfer
Notes: *1 POP.W Rn is identical to MOV.W @SP+, Rn.
Rev. 2.0, 06/04, page 30 of 980
*2 Not available in the H8/3029.
*3 Bcc is a generic branching instruction.
Instruction Set
Instruction Set Overview
PUSH.W Rn is identical to MOV.W Rn, @–SP.
POP.L ERn is identical to MOV.L @SP+, Rn.
PUSH.L ERn is identical to MOV.L Rn, @–SP.
Instruction Classification
MOV, PUSH*
AND, OR, XOR, NOT
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR, BXOR,
EEPMOV
Instruction
MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS, EXTU
BIXOR, BLD, BILD, BST, BIST
Bcc*
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
3
, JMP, BSR, JSR, RTS
1
, POP*
1
, MOVTPE*
2
, MOVFPE*
2
Total 62 types
Types
3
18
4
8
14
5
9
1