HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 901
HD64F3029XBL25V
Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.HD64F3029X25.pdf
(1012 pages)
Specifications of HD64F3029XBL25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- Current page: 901 of 1012
- Download datasheet (5Mb)
IOAR1B—I/O Address Register 1B
DTCR1B—Data Transfer Control Register 1B
Rev. 2.0, 06/04, page 872 of 980
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Short address mode
Full address mode
Note: Bit functions are the same as for DMAC0.
Note: Bit functions are the same as for DMAC0.
Bit
Bit
Bit
DTME
R/W
DTE
R/W
R/W
7
7
0
7
0
DTSZ
R/W
R/W
R/W
6
6
0
6
0
DTID
DAID
R/W
R/W
R/W
5
5
0
5
0
DAIDE
RPE
R/W
R/W
R/W
Undetermined
4
4
0
4
0
DTIE
R/W
R/W
TMS
R/W
3
3
0
3
0
H'FFF3E
H'FFF3F
DTS2B
DTS2
R/W
R/W
R/W
2
2
0
2
0
DTS1B
DTS1
R/W
R/W
R/W
1
1
0
1
0
DMAC1
DMAC1
DTS0B
DTS0
R/W
R/W
R/W
0
0
0
0
0
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