HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 798

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.4.5
Figure 21.22 shows the TPC and I/O port input/output timing.
CS
(RAS
RAS
UCAS,
LCAS
RD (WE)
(high)
RFSH
Port 1 to
B (read)
Port 1 to
6, 8 to B
(write)
5
2
to CS
5
)
to
TPC and I/O Port Timing
2
Figure 21.22 TPC and I/O Port Input/Output Timing
Figure 21.21 DRAM Bus Timing (Self-Refresh)
T
1
t
t
CSR2
CSR2
t
PRS
T
2
t
PRH
t
PWD
Rev. 2.0, 06/04, page 769 of 980
T
3