HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 613

Manufacturer Part Number

HD64F3029XBL25V

MCU 5V 512K,PB-FREE 100-TQFP

Manufacturer

Renesas Electronics America

H8® H8/300Hr

Core Processor

Connectivity

SCI, SmartCard

DMA, PWM, WDT

Number Of I /o

Program Memory Size

512KB (512K x 8)

Program Memory Type

Voltage - Supply (vcc/vdd)

Data Converters

A/D 8x10b; D/A 2x8b

Oscillator Type

Operating Temperature

-20°C ~ 75°C

Package / Case

100-TQFP, 100-VQFP

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Programming/erasing is executed by downloading the on-chip program to the on-chip RAM and

specifying the program address/data and erase block by using the interface register/parameter.

The procedure program is made by the user in user program mode and user boot mode. The

overview of the procedure is as follows. For details, see section 18.5.2, User Program Mode.

Rev. 2.0, 06/04, page 584 of 980

Programming/Erasing Interface

Note: *The RAM emulation can be performed in the eight blocks of 4 kbytes.

Address H'07FFFF

Address H'000000

Figure 18.4 Block Division of User MAT