HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 997

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Timing of Transition to Hardware Standby Mode
1. To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
2. To retain RAM contents with the RAME bit cleared to 0 in SYSCR, RES does not have to be
Timing of Recovery from Hardware Standby Mode: Drive the RES signal low approximately
100 ns before STBY goes high.
Rev. 2.0, 06/04, page 968 of 980
STBY
RES
STBY
RES
Appendix E Timing of Transition to and Recovery from
system clock cycles before the STBY signal goes low, as shown below. RES must remain low
until STBY goes low (minimum delay from STBY low to RES high: 0 ns).
driven low as in (1).
Hardware Standby Mode
t
1
t
10t
100 ns
cyc
t
2
0 ns
t
OSC