HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 794

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

BREQ
BACK
A
AS, RD,
HWR, LWR
A
CSn
A
AS
RD
D
Note:
23
23
2
15
to A
to A
to D
to A
0
3
0
*
0
,
Specification from the earliest negation timing of A
t
AD
t
AS1
t
AS1
T
1
Figure 21.17 Burst ROM Access Timing: three State Access
t
t
ASD
ASD
t
BRQS
t
ACC2
Figure 21.18 Bus-Release Mode Timing
t
t
ACC4
ACC4
T
2
t
SD
T
t
3
RDS
t
BACD1
t
t
AH
BZD
t
AD
23
t
to A
AS1
T
1
t
ASD
t
BRQS
0
,
+5
n, and
t
ACC2
Rev. 2.0, 06/04, page 765 of 980
T
4,
2
.
t
SD
T
t
RDS
3
t
t
BACD2
BZD
t
AH
t
RSD
t
RDH
*