HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 426

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Clear by Compare Match: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR,
8TCNT can be cleared when compare match A or B occurs, Figure 10.11 shows the timing of
this operation.
Compare match signal
8TCNT
N
H'00
Figure 10.11 Timing of Clear by Compare Match
Clear by Input Capture: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR,
8TCNT can be cleared when input capture B occurs. Figure 10.12 shows the timing of this
operation.
Input capture input
Input capture signal
8TCNT
N
H '00
Figure 10.12 Timing of Clear by Input Capture
10.4.3
Input Capture Signal Timing
Input capture on the rising edge, falling edge, or both edges can be selected by settings in 8TCSR.
Figure 10.13 shows the timing when the rising edge is selected.
The pulse width of the input capture input signal must be at least 1.5 system clocks when a single
edge is selected, and at least 2.5 system clocks when both edges are selected.
Rev. 2.0, 06/04, page 397 of 980

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