HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 699

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Error
response
The boot program will return indications of its present state and error condition. This inquiry can
be made in the inquiry/selection state or the programming/erasing state.
Command H'4F
Response
Rev. 2.0, 06/04, page 670 of 980
Boot Program State Inquiry
Error Response, H'CD, (1 byte) : Error response to the blank check of user MATs.
Error code H'52 (1 byte) : Erasure has not been completed.
Command, H'4F, (1 byte) : Inquiry regarding boot program’s state
Response, H'5F, (1 byte) : Response to boot program state inquiry
Size (1 byte) : The number of bytes that represents the STATUS and ERROR.
This is fixed to 2.
STATUS (1 byte) : State of the boot program
For details, see table 18.18.
ERROR (1 byte): Error state
ERROR = 0 indicates normal operation.
ERROR = 1 indicates error has occurred
For details, see table 18.19.
SUM (1 byte): Checksum
H'CD
H'5F
H'52
Size
STATUS
ERROR
SUM

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