HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 720

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Crystal Resonator: Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 19.2.
Table 19.2 Crystal Resonator Parameters
Frequency (MHz)
Rs max ( )
Co (pF)
Use a crystal resonator with a frequency equal to the system clock frequency ( ).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 19.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
XTAL
Figure 19.4 Oscillator Circuit Block Board Design Precautions
Avoid
C
C
L2
L1
Figure 19.3 Crystal Resonator Equivalent Circuit
10
30
7 (max)
L
12
30
7 (max)
Signal A
C
L
16
20
7 (max)
Signal B
C
0
18
20
7 (max)
AT-cut parallel-resonance type
Rev. 2.0, 06/04, page 691 of 980
Rs
XTAL
EXTAL
H8/3029 chip
20
20
7 (max)
25
20
7 (max)
EXTAL