HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 759

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
Three-state
leakage
current
Input pull-up
MOS current
Input
capacitance
Current
dissipation*
Analog power
supply current
Rev. 2.0, 06/04, page 730 of 980
2
Ports 1 to 6,
Ports 8 to B
Ports 2, 4,
and 5
FWE
NMI
All input pins
except NMI
Normal
operation
Sleep mode
Module
standby mode
Standby mode
Flash memory
programming/
erasing*
During A/D
conversion
During A/D
and D/A
conversion
Idle
4
Symbol
|I
–I
C
I
AI
CC
TSI
in
p
CC
*
|
3
Min
—
10
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
—
2.0(3.3V)
17(3.3V)
16(3.3V)
15(3.3V)
—
30(3.3V)
0.6
0.6
0.02(3.3V) 5.0
—
Max
1.0
300
80
50
15
38
35
34
70
100
48
1.5
1.5
15
Unit
µA
µA
pF
pF
pF
mA
mA
mA
µA
µA
mA
mA
mA
µA
µA
Test
Conditions
V
V
V
V
f = f
T
f = 25 MHz
f = 25 MHz
f = 25 MHz
T
50°C
f = 25 MHz
(reference
values)
T
at DASTE = 0
50°C
at DASTE = 0
a
a
a
in
CC
in
in
= 25°C
= 0.5 V to
= 0 V
= 0 V,
– 0.5 V
min
50°C
50°C
,
T
T
a
a